FLYCDI XG-001 Low-Temperature Solder Paste (138°C)

Specially formulated for delicate components and LED applications, this low-temp solder paste ensures effective bonding at just 138°C without damaging sensitive materials.

Key Features:

  • Melting point: 138°C

  • Alloy: Sn42-Bi58

  • Ideal for LED patches and heat-sensitive electronics

  • Smooth consistency for precise application

  • Net weight: 50g

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  • Warranty 1 year
  • Free 30-Day returns

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